310*320mm パネルサイズ パネルレベル QFN 低電気抵抗
価格: Negotiable
MOQ: Negotiable
納期: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... もっと見る
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310*320mm パネルサイズ 薄型MOSチップ シリコン 低消費電力
価格: Negotiable
MOQ: 3000pcs
納期: 1 month
ブランド: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... もっと見る
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パネルレベル 梱包面 ダウンEWLB 高熱分散 高信頼性
価格: Negotiable
MOQ: Negotiable
納期: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... もっと見る
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310*320mm ファンアウトパネルレベルパッケージ (FOPLP) GaN製品
価格: Negotiable
MOQ: 3000pcs
納期: 1 month
ブランド: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... もっと見る
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グラスを通るTGV
(7)
高画質比 TGV 半導体包装のための鋳造能力
価格: Negotiable
MOQ: 10 panel
納期: 1 month
ブランド: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... もっと見る
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様々なパッケージシミュレーション実験に適したパッケージ
価格: Negotiable
MOQ: 3000pcs
納期: 1 month
ブランド: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... もっと見る
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