BGAの基質

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BT FR4否定論履積の記憶基質板35/35um 4層ENEPIG

価格: US 120-150 per square meter

MOQ: 1 square meter

納期: 7-10 working days

ブランド: Horexs

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ハイライト:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... もっと見る

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ICのパッケージの基質

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eMMC ICのパッケージの基質PCB

価格: US 120-150 per square meter

MOQ: 1 square meter

納期: 7-10 working days

ブランド: Horexs

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ハイライト:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB

eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... もっと見る

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一口のパッケージの基質

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物質的な4Lが異質システムを結合する満ちる一口のパッケージの基質BTによってを経て/積み重ねなさい

価格: US 99-120 each piece

MOQ: 1 square meter

納期: 7-10 working days

ブランド: Horexs

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ハイライト:Stack Via Sip Package Substrate, Via Filling Sip Package Substrate, BT Sip Package Substrate

stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi-functions associated with a system or sub-system in one single package. It is essential to next-generation package for ... もっと見る

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FCCSPのパッケージの基質

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フリップ・チップ アセンブリのためのBT FCCSPのパッケージの基質3x3mmの緑色

価格: US 85-100 per square meter

MOQ: 1 square meter

納期: 7-10 working days

ブランド: Horexs

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ハイライト:Green FCCSP Package Substrate, 3x3mm FCCSP Package Substrate, 0.3mm FCCSP Package Substrate

FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... もっと見る

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センサーの基質

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半導体センサーの基質の製造

価格: US 0.1-0.12 each piece

MOQ: 1000pieces

納期: 7-10 working days

ブランド: Horexs

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ハイライト:Fingerprint Recognition PCB Board Fabrication, UL Fingerprint Recognition PCB, Fingerprint Recognition PCB For Intelligent Lock

Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki... もっと見る

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RFモジュールの基質

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RFモジュールの基質のインピーダンス制御4L BT物質的で柔らかい金

価格: US 0.089-0.109 each piece

MOQ: 1000pieces

納期: 7-10 working days

ブランド: Horexs

{"cid":"49360","pid":"13180447","pimg_url":"\/\/img1.tradegrowthhub.com\/6e\/00\/07eea3f2d1aa\/product\/106164741_s-w400xh400.jpg","name":"RF\u30e2\u30b8\u30e5\u30fc\u30eb\u306e\u57fa\u8cea\u306e\u30a4\u30f3\u30d4\u30fc\u30c0\u30f3\u30b9\u5236\u5fa14L BT\u7269\u8cea\u7684\u3067\u67d4\u3089\u304b\u3044\u91d1","attrs":{"\u4fa1\u683c":"US 0.089-0.109 each piece","MOQ":"1000pieces","\u7d0d\u671f":"7-10 working days","\u30d6\u30e9\u30f3\u30c9":"Horexs"}}

ハイライト:Goldfinger Fingerprint Recognition PCB, FR4 Fingerprint Recognition PCB, 0.15mm Fingerprint Recognition PCB

Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) Finished thickness:0.21mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; S... もっと見る

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記憶基質

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4Layer MicroSDカード基質の生産

価格: US 120-150 per square meter

MOQ: 1 square meter

納期: 7-10 working days

ブランド: Horexs

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ハイライト:Rohs Pcb Gold Finger Plating, High Density Pattern Pcb Gold Finger, Custom Pcb Gold Finger Plating

Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal connections between IC and PCB, in addition to protecting circuits, fixing lines, and dissipating residual heat. Application: ​NAND memory Flash... もっと見る

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MEMSの基質

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OEM ODM BT材料MEMS/CMOSの基質の多層基質の製造

価格: US 120-150 per square meter

MOQ: 1 square meter

納期: 7-10 working days

ブランド: Horexs

{"cid":"49360","pid":"13373284","pimg_url":"\/\/img1.tradegrowthhub.com\/6e\/00\/07eea3f2d1aa\/product\/31805385_s-w400xh400.jpg","name":"OEM ODM BT\u6750\u6599MEMS\/CMOS\u306e\u57fa\u8cea\u306e\u591a\u5c64\u57fa\u8cea\u306e\u88fd\u9020","attrs":{"\u4fa1\u683c":"US 120-150 per square meter","MOQ":"1 square meter","\u7d0d\u671f":"7-10 working days","\u30d6\u30e9\u30f3\u30c9":"Horexs"}}

ハイライト:OEM MEMS PCB, ODM MEMS PCB, BT Multilayer Circuit Board

Ultrathin MEMS PCB use OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) fini... もっと見る

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IoTの基質

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IoTの企業の半導体のためのBGA/QFNのパッケージの基質の生産

価格: US 0.1-0.12 each piece

MOQ: 1000pieces

納期: 7-10 working days

ブランド: Horexs

{"cid":"49360","pid":"13347112","pimg_url":"\/\/img1.tradegrowthhub.com\/6e\/00\/07eea3f2d1aa\/product\/106387757_s-w400xh400.jpg","name":"IoT\u306e\u4f01\u696d\u306e\u534a\u5c0e\u4f53\u306e\u305f\u3081\u306eBGA\/QFN\u306e\u30d1\u30c3\u30b1\u30fc\u30b8\u306e\u57fa\u8cea\u306e\u751f\u7523","attrs":{"\u4fa1\u683c":"US 0.1-0.12 each piece","MOQ":"1000pieces","\u7d0d\u671f":"7-10 working days","\u30d6\u30e9\u30f3\u30c9":"Horexs"}}

ハイライト:4 Layer Camera Module PCB, Horexs Camera Module PCB, Horexs 4 Layer PCB

Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuis... もっと見る

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他の極めて薄い基質

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マイクロエレクトロニクスICの基質の製造

価格: US 95-120 per square meter

MOQ: 1 square meter

納期: 7-10 working days

ブランド: Horexs

{"cid":"49360","pid":"13056582","pimg_url":"\/\/img1.tradegrowthhub.com\/6e\/00\/07eea3f2d1aa\/product\/31674091_s-w400xh400.jpg","name":"\u30de\u30a4\u30af\u30ed\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9IC\u306e\u57fa\u8cea\u306e\u88fd\u9020","attrs":{"\u4fa1\u683c":"US 95-120 per square meter","MOQ":"1 square meter","\u7d0d\u671f":"7-10 working days","\u30d6\u30e9\u30f3\u30c9":"Horexs"}}

ハイライト:Halogen Free PCB Circuit Board, ODM PCB Circuit Board, Bonding Halogen Free PCB

Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4... もっと見る

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極めて薄く堅いPCB

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FR4磁芯記憶装置ICの基質の製造

価格: US 0.089-0.109 each piece

MOQ: 1000pieces

納期: 7-10 working days

ブランド: Horexs

{"cid":"49360","pid":"13181476","pimg_url":"\/\/img1.tradegrowthhub.com\/6e\/00\/07eea3f2d1aa\/product\/31676442_s-w400xh400.jpg","name":"FR4\u78c1\u82af\u8a18\u61b6\u88c5\u7f6eIC\u306e\u57fa\u8cea\u306e\u88fd\u9020","attrs":{"\u4fa1\u683c":"US 0.089-0.109 each piece","MOQ":"1000pieces","\u7d0d\u671f":"7-10 working days","\u30d6\u30e9\u30f3\u30c9":"Horexs"}}

ハイライト:0.4mm Electronic Printed Circuit Board, Smooth Solder Resist Printed Circuit Board, 0.4mm Printed Circuit Board

Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: ​Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package S... もっと見る

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医療機器PCB

(1)

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ヘルスケアの電子工学/マイクロ ヒアリングの電子工学PCBの製造

価格: US 85-120 each square meter

MOQ: 10 squre meters

納期: 7-10 working days

ブランド: Horexs

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ハイライト:0.2mm Medical Equipment PCB, Highly Intensive Medical Equipment PCB, 0.2mm Routed Circuit Board

Application:healthy electronics,Microelectronics devices,others; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Othe... もっと見る

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