一口のパッケージの基質
(3)
物質的な4Lが異質システムを結合する満ちる一口のパッケージの基質BTによってを経て/積み重ねなさい
価格: US 99-120 each piece
MOQ: 1 square meter
納期: 7-10 working days
ブランド: Horexs
ハイライト:Stack Via Sip Package Substrate, Via Filling Sip Package Substrate, BT Sip Package Substrate
stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi-functions associated with a system or sub-system in one single package. It is essential to next-generation package for ... もっと見る
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Anylayer/集結タイプは包装の基質の製造をすする
価格: US 120-150 per square meter
MOQ: 1 square meter
納期: 7-10 working days
ブランド: Horexs
ハイライト:Horexs PCB, Gold Plated RAM PCB, 0.8mm RAM PCB Board
Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mai... もっと見る
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一口のパッケージの基質BT材料4の層ENEPIG
価格: US 99-120 each piece
MOQ: 1 square meter
納期: 7-10 working days
ブランド: Horexs
ハイライト:Custom TF Card RAM PCB, FR4 RAM PCB, BT Camera Circuit Board
Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,R... もっと見る
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