IC結合機
(6)
IC結合機
価格: Negotiable
MOQ: ≥1 pc
納期: 25~50 days
ブランド: Suneast
ハイライト:combined selective multi module wave solder, wave soldering multi module combined selective, combined multi module wave solder selective
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... もっと見る
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多層IC結合機 0.25*0.25mm-10*10mm ダイボンド機器
価格: Negotiable
MOQ: ≥1 pc
納期: 25~50 days
ブランド: Suneast
ハイライト:soldering combined multi module wave selective, selective multi module combined wave soldering, combined wave soldering selective multi module
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image p... もっと見る
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高精度IC結合機 8-12インチワッフル ダイボンド
価格: Negotiable
MOQ: ≥1 pc
納期: 25~50 days
ブランド: Suneast
ハイライト:combined wave soldering multi module selective, magnetic spring motor ce iso, iso ce magnetic spring motor
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic ... もっと見る
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速速交換IC ダイボンドマシン スーパーミニチップボンドマシン
価格: Negotiable
MOQ: ≥1 pc
納期: 25~50 days
ブランド: Suneast
ハイライト:wave soldering selective combined multi module, multi module combined wave soldering selective, multi module wave soldering selective combined
Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips. Featu... もっと見る
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高速小足跡IC結合機 モジュラルのプラットフォーム ダイ ボンダーマシン
価格: Negotiable
MOQ: ≥1 pc
納期: 25~50 days
ブランド: Suneast
ハイライト:spring motor ce iso magnetic, motor iso magnetic spring ce, selective wave solder multi module combined
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types of chip placement High flexibility to suppor... もっと見る
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デイ・ボンダー (SDB 200) をシントリングする
価格: Negotiable
MOQ: ≥1 pc
納期: 25~50 days
ブランド: Suneast
ハイライト:selective multi module combined wave solder, wave solder combined selective multi module, selective wave solder combined multi module
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... もっと見る
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