半導体鋳造装置
(25)
水冷却 半導体加工設備 半導体鋳造システム 高圧
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Water Cooling Semiconductor Processing Equipment, Water Cooling Semicon Molding System, High Pressure Semiconductor Processing Equipment
Semicon Molding System Product Detail: Product Name: Semiconductor Molding Equipment Energy Consumption: Low Control System: PLC Application: Semiconductor Industry Molding Method: Injection Molding Capacity: High Plasticizing Press Plasticizing Press Plasticizing Press PLC Control System ● The auto... もっと見る
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1000トンの半導体鋳造設備 プラスチックシール装置 高精度
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:1000 Tons Semiconductor Molding Equipment, Semiconductor Molding Equipment High Precision, semiconductor molding machine High Precision
Automatic Semiconductor Plastic seal Device FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this product is 002. Q: Where is this product manufactured? A: This product is manufactured in Ch... もっと見る
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全自動半導体型成形装置
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Fully Automatic Semiconductor Molding Equipment, Fully Automatic Semiconductor Molding machine
Fully Automatic Transfer Molding' Features ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansio... もっと見る
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高効率の半導体包装機器
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Highly efficient Semiconductor Packaging Equipment, Highly efficient ic packaging Equipment
Semiconductor Packaging Equipment Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... もっと見る
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自動チップエンカプスリングシステム
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Auto Chip Encapsulation System, Auto Chip encapsulation equipment
Auto Chip Encapsulation System Packing and Shipping: Packaging and Shipping for Semiconductor Molding Equipment Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any da... もっと見る
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チップ転送 鋳造 半導体製造 設備 水冷却
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Chip Transfer Molding semiconductor manufacturing equipment, Chip Transfer Molding semiconductor manufacturing machine, Semiconductor Manufacturing Equipment Water Cooling
Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology and features to ensure effici... もっと見る
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信頼性の高い半導体鋳造機器 円滑に動作する PLC制御
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Reliable Semiconductor Molding Equipment, Reliable semiconductor molding machine, PLC Controlled Semiconductor Molding Equipment
TJIN Semiconductor Molding Equipment Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art tec... もっと見る
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高生産性半導体包装設備 チップ鋳造装置
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:High Productivity Semiconductor Packaging Equipment, High Productivity Chip Molding Device
Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; Semiconductor plastic seal... もっと見る
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省エネ 半導体 鋳造 装置 半導体 移転 鋳造
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Energy Saving Semiconductor Molding Equipment, Energy Saving semiconductor molding machine, Semicon Transfer Molding Equipment
Auto Semicon Transfer Molding Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology... もっと見る
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半導体産業ICパッケージング 機器 チップ鋳造システム 自動化
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Semiconductor Industry IC Packaging Equipment, Semiconductor Industry Chip Molding System, IC Packaging Equipment Automated
Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test. Product Description: Semiconductor Molding Equipment Th... もっと見る
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高効率の半導体鋳造装置 チップ鋳造システム 50/60Hz
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:High Efficient Semiconductor Molding Equipment, High Efficient Chip Molding System, Semiconductor Molding Equipment 60Hz
Semiconductor Chip Molding System 【Features】 ● Semiconductor packaging equipment is also known as chip packaging equipment and IC packaging equipment, semiconductor MOLDING packaging equipment; ● Automatic packaging test chip, semiconductor device, IC and other products; ● Full servo control system,... もっと見る
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シングルインジェクション半導体鋳造機 完全自動転送鋳造
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Single Injection semiconductor molding machine, Single Injection semiconductor fab equipment, Semiconductor Molding Machine Fully Automatic
Fully Automatic Transfer Molding 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; ● Full servo ... もっと見る
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完全自動半導体製造機器 注射鋳造用
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Full Auto Semiconductor Production Equipment, Injection Molding Semiconductor Production Equipment, Injection Molding semiconductor fab equipment
Automatic Molding System Product Description: Semiconductor Molding Equipment Our Semiconductor Molding Equipment is designed specifically for the semiconductor industry and offers a fully automatic molding system with advanced control capabilities. With our state-of-the-art PLC control system, our ... もっと見る
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90KWの半導体鋳造装置 半導体転送鋳造装置
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:90KW Semiconductor Molding Equipment, Semicon Transfer Molding Device, 90KW semiconductor molding machine
Semicon Transfer Molding 【Performance parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm in length, 0.15-1.2mm thick; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length/diameter ... もっと見る
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高生産性半導体鋳造設備 オートチップ鋳造システム
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:High Productivity Semiconductor Molding Equipment, High Productivity Chip Molding System, Chip Molding Semiconductor Molding Equipment
Auto Chip Molding System Technical Parameters: Parameter Value Maintenance Easy Control System PLC Application Semiconductor Industry Capacity High Cycle Time Short Safety Features Advanced Molding Method Injection Molding Precision High Energy Consumption Low Pressure Control Precision Pressure Con... もっと見る
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電動半導体型成形装置 半導体包装システム
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Semiconductor Molding Equipment Semicon Encapsulation, Electric Powered Semiconductor Molding Equipment, Electric Powered semiconductor molding machine
Auto Semicon Encapsulation System Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... もっと見る
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チップエンカプスレーションシステム 半導体ファブ機器 エネルギー効率
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Chip Encapsulation semiconductor fab equipment, Semiconductor Fab Equipment Energy Efficient, Chip Encapsulation System Energy Efficient
Auto Chip Encapsulation System Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... もっと見る
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オートプラスチシングプレス 半導体チップ製造機械 ISO9001 認定
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Auto Plasticizing Press Chip Manufacturing Machines, ISO9001 Semiconductor Chip Manufacturing Machines, ISO9001 chip manufacturing equipment
Auto Plasticizing Press Machine Product Detail: ● Full servo control system, PLC (Omron)+upper machine; ● Win10+15 -inch touch screen+touch keyboard; ● CCD image detection, feed anti -counter -anti -detection ● Standardized mold structure, convenient replacement; ● High -efficient ingredients, cakes... もっと見る
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チッププラスチケーションプレス半導体鋳造機器 380V 50Hz
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:Chip Plasticizing Press Semiconductor Molding Equipment, Chip Plasticizing Press semiconductor molding machine, Semiconductor Molding Equipment 380V
Chip Plasticizing Press Customization: TJIN Semiconductor Molding Equipment Customized Service Brand Name: TJIN Model Number: 002 Place of Origin: China Precision: High Capacity: High Maintenance: Easy Control System: PLC Safety Features: Advanced Our company, TJIN, specializes in providing customiz... もっと見る
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高自動化半導体製造機械 半導体鋳造機器
価格: Negotiable
MOQ: 1 set
納期: 40 days
ブランド: TJIN
ハイライト:highly Automation semiconductor fabrication machines, highly Automation Semicon Molding Equipment
Auto Semicon Molding Equipment Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... もっと見る
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