CSP LED チップ
(7)
1.0*0.5mm ウェーファーパッケージング 1005 CSPチップ LEDチップ 1800-6500K スマートウォッチ用 自動車内装照明用
価格: Negotiable
MOQ: 200K
納期: 7-10 workdays
ハイライト:Customized CSP LED Chip, Mini CSP LED Chip, 1800K White LED Chip
Features: The latest generation of LED products utilizes CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact ... もっと見る
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0.7x0.5x0.3mm 0705 上部と4面 100mAを発するFlip Chip CSP光学表示用のLEDチップ
価格: Negotiable
MOQ: 200K
納期: 7-10 workdays
Features: The latest generation of LED products utilizes CSP chip-level packaging technology. Manufactured using flip chip technology and fluorescent film. Features excellent resistance to high temperatures, superior heat dissipation, and minimal light decay. Can be arranged and combined freely on a... もっと見る
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0.7x0.4x0.3mm 0704 CSP チップ 1800-6500K 良い熱分散 LED チップ 信号照明器用
価格: Negotiable
MOQ: 200K
納期: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, wit... もっと見る
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1.3x1.3x0.3mm 1313 上部と四面 700mA CSP LEDチップをバックライトとスマートウェアに使用
価格: Negotiable
MOQ: 200K
納期: 7-10 workdays
Features: CSP chip-level packaging technology for next-generation LED solutions. Manufactured with flip-chip technology and phosphor film. Excellent high-temperature resistance, superior thermal management, and minimal light degradation. Flexible arrangement and combination on a compact light-emitti... もっと見る
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1.0x1.0x0.3mm 1010 300mA 発光フィルム CSP チップ LED シンボルのための照明器
価格: Negotiable
MOQ: 200K
納期: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, with ... もっと見る
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0.9x0.5x0.4mm 0905 Excellent Color Consistency CSP LED For Lamp Tube
価格: Negotiable
MOQ: 200K
納期: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, with ... もっと見る
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0.8x0.5x0.4mm 0805 Flip Chip Framed Auxiliary Electrode CSP LED For Outdoor Displays
価格: Negotiable
MOQ: 200K
納期: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, with ... もっと見る
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