Chengdu Cesgate Technology Co., Ltd

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OSP stands for Organic Solderability Preservative, which is a process of PCB copper surface treatment that meets the RoHS requirements.

Simply put, OSP is to chemically grow an organic film on the clean bare copper surface. This layer of film has anti-oxidation, thermal shock resistance, moisture resistance, and is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in the normal environment; but in the subsequent high temperature welding, this protective film must be very It is easily and quickly removed by the flux, so that the exposed clean copper surface can be combined with the molten solder to form a strong solder joint in a very short time.