FZXZHIXIN Video

Product process: The company focuses on the core process research of board-level fan-out packaging, and has mastered a number of semiconductor fan-out packaging core processes such as glass microvia processing and metallization technology, board-level high-depth-to-width copper column process, board-level warpage control and chip offset correction, etc., of which the glass microvia metallization technology has reached the international first-class level.
The company has built the first large board-level fan-out packaging demonstration line in China, including 1500 square meters of clean room, the introduction of 20 sets of core equipment, such as plastic sealing machine, mounter, lithography, high-speed plating machine, etc., for domestic and foreign leading enterprises to carry out high-end personalized board-level fan-out packaging customization services.At the same time, the company built a test service center, the introduction of scanning electron microscope, energy spectrometer, 3D microscope, AOI and other 10 sets of test equipment, for enterprises to carry out chip testing and analysis services.
Enterprise services: Relying on the chip board-level fan-out packaging demonstration line, the company has carried out gallium nitride power device packaging services for domestic famous communication enterprises, applied to 5G base stations; carried out high-density glass substrate packaging services for domestic famous IC design enterprises, applied to FPGA, GPU, etc.; provided MOSFET multi-chip integrated packaging services for European famous IC enterprises, applied to new energy vehicles, etc.; provided chip packaging services for domestic famous chip foundry enterprises, applied to new energy vehicles, etc.; provided chip testing services for enterprises.Domestic famous chip foundry enterprises to provide chip testing and analysis services.The company has formed a complete set of equipment, materials, process technology, in order to carry out high-end personalized board fan-out packaging customized services at the same time, plans to build a chip board fan-out packaging mass production line in 2025, to provide large-scale mass production packaging services.
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